SHD Sim FEA
Thermal stress
Thermal field to mechanical, one-way
code_aster
In development.
This module is phase 2 — the next module after cfd. The solver behind it is chosen and its capability is known. SHD Sim is available today.
What it is
A temperature field imposed on a structure that is not free to expand. The stress comes entirely from restraint — an unrestrained part heats up and grows without stressing itself at all — so the boundary conditions matter more here than in almost any other analysis.
What this analysis needs from you
- A thermal expansion coefficient, and a stress-free reference temperature
- A temperature field, either solved first or imposed
- Restraints that reflect reality — over-restraining inflates the stress dramatically
Typical uses
- Exhaust and manifold components
- Electronics solder joints under thermal cycling
- Pipework between fixed anchors
- Anything joining two materials with different expansion coefficients
Industries
Sectors where this analysis is routinely asked for.
- Power generation
- Exhaust systems
- Electronics packaging
- Process plant
What comes out
- Thermal stress distribution
- Constrained expansion forces
- Distortion under temperature
- Cycling severity indicators
Backend
code_aster
Chosen for this analysis type, with its capability verified against the module plan — not decided later.
Status
Phase 2 — the next module after CFD. Telling us you need this analysis moves it up the order — modules are sequenced by who is waiting for them.