Electronics & hardware
Simulation for electronics cooling and hardware design
Board and enclosure thermal work where the air and the solid are solved together, conduction-only checks when there is no air to speak of, and the electrostatic and DC-conduction problems that sit alongside them. Most electronics thermal questions are conjugate heat transfer, which is a first-class case type here rather than an add-on.
Questions this answers
- Does this enclosure keep the parts inside it within temperature?
- Where does the heat actually leave this assembly?
- What does the junction temperature do under a duty cycle rather than at steady state?
- Is this heatsink doing anything, and how much?
- What is the field around this electrode or insulator?
The analysis types that do it
Each of these is a case type in the application, not a configuration you assemble. Every one runs in the free build — the free tier limits mesh size and cores, never which physics you may use.
And in the other modules
Structural, thermal and electromagnetics ship alongside fluids. Only the types that run today are listed.
Backends underneath
chtMultiRegionFoamchtMultiRegionSimpleFoambuoyantSimpleFoambuoyantPimpleFoambuoyantBoussinesqSimpleFoamlaplacianFoamthermoFoamsolidFoam
Open-source solvers, selected and configured from the case type. You can still read every dictionary the application writes.
When it will not fit on your machine
Paid accounts can send meshing and solving to SHD Cloud and keep working locally. The estimate is shown before the run starts.
What this does not do
- No ECAD import. Boards come in as geometry, not as layer stacks with copper fractions read from the layout.
- No compact thermal models or two-resistor component libraries — components are geometry and a heat load.
- Signal integrity and RF are not in the product; the electromagnetics module is low-frequency.
Naming a sector here says the physics suits the work. It is not a claim that anyone in it is a customer.