SHD Sim Thermal
Steady conduction
Solid-only
code_aster / Elmer
In development.
This module is phase 2–3 — largely arrives with structural. The solver behind it is chosen and its capability is known. SHD Sim is available today.
What it is
Laplace's equation on temperature: no flow, no time, one material property. The answer is where the heat goes once everything has settled, and it is the cheapest analysis in the catalogue.
What this analysis needs from you
- Thermal conductivity for each material
- At least one fixed temperature or heat flux, since an all-adiabatic model has no solution
- A mesh fine enough across the thinnest conducting path
Typical uses
- Insulation thickness and material selection
- Heat sink base spreading
- Cold bridging through building elements
- Checking a hand-calculated thermal resistance against real geometry
Industries
Sectors where this analysis is routinely asked for.
- Building fabric
- Electronics packaging
- Insulation systems
- Process equipment
What comes out
- Temperature distribution
- Heat flow per surface
- Thermal resistance of the assembly
- Cold-bridge locations
Backend
code_aster / Elmer
Chosen for this analysis type, with its capability verified against the module plan — not decided later.
Status
Phase 2–3 — largely arrives with structural. Telling us you need this analysis moves it up the order — modules are sequenced by who is waiting for them.